INTERCONNECTIONS AND 3-D MICROPACKAGING

Authors
VAL C BONNEFOY P DROUHIN I GERARD A LEROY M LETZELTER G
Citation
C. Val et al., INTERCONNECTIONS AND 3-D MICROPACKAGING, Onde electrique, 74(2), 1994, pp. 53-58
Citations number
NO
Categorie Soggetti
Telecommunications,"Engineering, Eletrical & Electronic
Journal title
Onde electrique → ACNP
ISSN journal
00302430
Volume
74
Issue
2
Year of publication
1994
Pages
53 - 58
Database
ISI
SICI code
0030-2430(1994)74:2<53:IA3M>2.0.ZU;2-J
Abstract
Classical 2-dimension interconnection is compared to new technologies, using the 3rd dimension. The area of use for 3D interconnection techn iques are presented from the stacking of identical chips (memories for example), to the stacking of heterogeneous elements leading to the fi rst microsystems, the middle step being the stacking of heterogeneous chips (calculation node for example). improvement in interconnection t echnology opens great perspectives for more complex microsystems.