DEVELOPMENT OF NEW ASSEMBLY TECHNIQUES FOR A SILICON MICRO-VERTEX DETECTOR UNIT USING THE FLIP-CHIP BONDING METHOD

Authors
SAITOH Y TAKEUCHI H MANDAI M KANAZAWA H YAMANAKA J MIYAHARA S KAMIYA M FUJITA Y HIGASHI Y IKEDA H IKEDA M KOIKE S MATSUDA T OZAKI H TANAKA M TSUBOYAMA T AVRILLON S OKUNO S HABA J HANAI H MORI S YUSA K FUKUNAGA C
Citation
Y. Saitoh et al., DEVELOPMENT OF NEW ASSEMBLY TECHNIQUES FOR A SILICON MICRO-VERTEX DETECTOR UNIT USING THE FLIP-CHIP BONDING METHOD, Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 342(1), 1994, pp. 298-301
Citations number
2
Categorie Soggetti
Nuclear Sciences & Tecnology","Physics, Particles & Fields","Instument & Instrumentation",Spectroscopy
Journal title
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment → ACNP
ISSN journal
01689002
Volume
342
Issue
1
Year of publication
1994
Pages
298 - 301
Database
ISI
SICI code
0168-9002(1994)342:1<298:DONATF>2.0.ZU;2-B
Abstract
Full-size models of a detector unit for a silicon micro-vertex detecto r were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film was examined. The struct ure using the FCB method successfully provides a new architecture for the silicon micro-vertex detector unit.