PACKAGING CONSIDERATIONS FOR PLANAR OPTICAL INTERCONNECTION SYSTEMS

We discuss various aspects of building an integrated optoelectronic sy stem that is based on the concept of planar optics. A particular optic al interconnection system has been fabricated and demonstrated. It pro vides parallel interconnections with 1024 optical channels that could be useful as an optical backplane in an optoelectronic multichip modul e. We consider the design and the fabrication of the optical system, s chemes for the hybrid integration with optoelectronic device arrays, a nd the thermal management of an integrated system. The proposed hybrid integration scheme is based on mature technologies such as thermal an odic bonding and flip-chip bonding. Possibilities for efficient heat s inking are described.