OPTIMUM PLACEMENT FOR OPTOELECTRONIC MULTICHIP MODULES AND THE SYNTHESIS OF DIFFRACTIVE OPTICS FOR MULTICHIP-MODULE INTERCONNECTS

Decreasing the system volume for optoelectronic (OE) planar systems is achieved by advancing computer-aided design of OE multichip modules ( MCM's). It is shown that in order to minimize the volume in an OE MCM, it is necessary to minimize the maximum interconnect distance. To ach ieve this, we have developed placement algorithms based on the constra ints of a given irregular interconnect pattern. Results are given for a twin-butterfly network for two general physical models: a transmissi ve MCM and a reflective MCM. We then show three different types of hol ogram design that can be used to implement the interconnect array. The se elements are for reconstruction in the near field and are fabricate d by direct-write electron-beam lithography. Both simulated and experi mental reconstructions are demonstrated.