THE USE OF THIN-FILM THERMOCOUPLES TO DETERMINE THE THERMAL-CONDUCTIVITY AND YOUNGS MODULUS OF COATINGS AND INTERFACES

Citation
S. Krishnan et al., THE USE OF THIN-FILM THERMOCOUPLES TO DETERMINE THE THERMAL-CONDUCTIVITY AND YOUNGS MODULUS OF COATINGS AND INTERFACES, The Journal of adhesion, 42(1-2), 1993, pp. 103-112
Citations number
23
Categorie Soggetti
Engineering, Chemical","Material Science
Journal title
ISSN journal
00218464
Volume
42
Issue
1-2
Year of publication
1993
Pages
103 - 112
Database
ISI
SICI code
0021-8464(1993)42:1-2<103:TUOTTT>2.0.ZU;2-7
Abstract
Linear and differential thin film thermocouples, typically 500-1000ang strom thick, were fabricated on flexible polymer and paper substrates by thermal evaporation. Both types of thermocouples had thermal sensit ivities of approximately 4 muV/degrees-C, for temperatures between 20- degrees-C and 40-degrees-C, on the paper and polymer-coated paper subs trates. The transverse thermal conductivity (k(t)), i.e., thermal cond uctivity in the direction perpendicular to the plane of the films, of polyimide (Kapton-H(R)) films, of a clay-coated paper, and of a polyst yrene coating on paper were determined by depositing linear thermocoup les on both sides of the films and raising the temperature of one junc tion and measuring the heat flux and, at equilibrium, the temperature of the other junction. Shear and Young's moduli of the polymer films w ere estimated from the measured thermal conductivity values, assuming the Debye model of thermal conductivity.