S. Krishnan et al., THE USE OF THIN-FILM THERMOCOUPLES TO DETERMINE THE THERMAL-CONDUCTIVITY AND YOUNGS MODULUS OF COATINGS AND INTERFACES, The Journal of adhesion, 42(1-2), 1993, pp. 103-112
Linear and differential thin film thermocouples, typically 500-1000ang
strom thick, were fabricated on flexible polymer and paper substrates
by thermal evaporation. Both types of thermocouples had thermal sensit
ivities of approximately 4 muV/degrees-C, for temperatures between 20-
degrees-C and 40-degrees-C, on the paper and polymer-coated paper subs
trates. The transverse thermal conductivity (k(t)), i.e., thermal cond
uctivity in the direction perpendicular to the plane of the films, of
polyimide (Kapton-H(R)) films, of a clay-coated paper, and of a polyst
yrene coating on paper were determined by depositing linear thermocoup
les on both sides of the films and raising the temperature of one junc
tion and measuring the heat flux and, at equilibrium, the temperature
of the other junction. Shear and Young's moduli of the polymer films w
ere estimated from the measured thermal conductivity values, assuming
the Debye model of thermal conductivity.