HOT-CARRIER-RELIABILITY DESIGN GUIDELINES FOR CMOS LOGIC-CIRCUITS

Citation
Kn. Quader et al., HOT-CARRIER-RELIABILITY DESIGN GUIDELINES FOR CMOS LOGIC-CIRCUITS, IEEE journal of solid-state circuits, 29(3), 1994, pp. 253-262
Citations number
35
Categorie Soggetti
Engineering, Eletrical & Electronic
ISSN journal
00189200
Volume
29
Issue
3
Year of publication
1994
Pages
253 - 262
Database
ISI
SICI code
0018-9200(1994)29:3<253:HDGFCL>2.0.ZU;2-S
Abstract
Long-term ring-oscillator hot-carrier degradation data and simulation results are compared to demonstrate that a circuit reliability simulat or BERT can predict CMOS digital circuit speed degradation from transi stor dc stress data. We present generalized hot-carrier-reliability de sign rules that translate device-level degradation rate to CMOS circui t lifetime. The design rules, which consist of lifetime and speed degr adation factors, can roughly predict CMOS circuit degradation during t he initial design, and can help reliability engineers to quickly estim ate the overall product hot-carrier reliability. The NMOSFET and PMOSF ET lifetime factors were found to obey 4/ft(rise) and 10/ft(fill) resp ectively. Typically, the NMOSFET and PMOSFET speed degradation factors are 1/4 and 1/2, respectively, with saturation region drain current a s the monitor, while for a 100 MHz operating frequency and for an inpu t rise time of 0.35 ns, the NMOSFET and PMOSFET time factors are 120 a nd 300, respectively.