PLASMA PROCESSES IN METHANE DISCHARGES DURING RF PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION OF A-CH THIN-FILMS

Citation
Eha. Dekempeneer et al., PLASMA PROCESSES IN METHANE DISCHARGES DURING RF PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION OF A-CH THIN-FILMS, Thin solid films, 241(1-2), 1994, pp. 269-273
Citations number
15
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
241
Issue
1-2
Year of publication
1994
Pages
269 - 273
Database
ISI
SICI code
0040-6090(1994)241:1-2<269:PPIMDD>2.0.ZU;2-D
Abstract
Methane-hydrogen capacitively coupled r.f. (13.56 MHz) discharges were studied using a mass spectrometer. The relative concentrations of neu tral species (CH4, C2Hx) were investigated in a broad range of dischar ge parameters (pressure 1.5-50 Pa, residence time 1-45 s, and r.f. pow er 0-120 W) and correlated with deposition rate measurements. It is sh own that the chemical plasma processes (C2H, formation) and deposition characteristics (deposition rate) are strongly correlated with the de gree of methane dissociation. These observations are interpreted in te rms of the occurrence of dominant CH(y)-CH4 reaction pathways for the production of C2Hx and a simple growth model based on a combined mecha nism of CH3 radical adsorption and ion bombardment. The pressure depen dence of the degree of dissociation of methane is correlated with the existence of various discharge regimes (alpha and gamma).