Eha. Dekempeneer et al., PLASMA PROCESSES IN METHANE DISCHARGES DURING RF PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION OF A-CH THIN-FILMS, Thin solid films, 241(1-2), 1994, pp. 269-273
Methane-hydrogen capacitively coupled r.f. (13.56 MHz) discharges were
studied using a mass spectrometer. The relative concentrations of neu
tral species (CH4, C2Hx) were investigated in a broad range of dischar
ge parameters (pressure 1.5-50 Pa, residence time 1-45 s, and r.f. pow
er 0-120 W) and correlated with deposition rate measurements. It is sh
own that the chemical plasma processes (C2H, formation) and deposition
characteristics (deposition rate) are strongly correlated with the de
gree of methane dissociation. These observations are interpreted in te
rms of the occurrence of dominant CH(y)-CH4 reaction pathways for the
production of C2Hx and a simple growth model based on a combined mecha
nism of CH3 radical adsorption and ion bombardment. The pressure depen
dence of the degree of dissociation of methane is correlated with the
existence of various discharge regimes (alpha and gamma).