M. Diani et al., ELECTRON-CYCLOTRON-RESONANCE PLASMA ION-BEAM EFFECTS ON THE FORMATIONOF SIC ON SI(001) CHARACTERIZED BY IN-SITU PHOTOEMISSION, Thin solid films, 241(1-2), 1994, pp. 305-309
Nanometric SiC overlayer synthesis has been performed via an ultrahigh
vacuum-compatible microwave electron cyclotron resonance plasma sourc
e. The H-2 plasma streaming onto a Si(001) substrate, whose temperatur
e T(s) could be varied from room temperature to 850-degrees-C, activat
es and dissociates CH4 molecules. The films are characterized in situ
by angle-resolved photoemission techniques. Without the H-2 plasma, no
surface reaction of CH4 is observed with the Si irrespective of T(s)
up to 850-degrees-C and exposures up to 10(6) L. H-2 plasma excitation
leads to the rapid formation of a thin SiC overlayer in the whole T(s
) range. For temperatures below a threshold of about 700-degrees-C whe
re thermal interdiffusion between Si and C is negligible, the SiC over
layer thickness rapidly saturates in the nanometric range and the SiC
formed is not structured. This thickness is essentially determined by
ion penetration in the substrate which can be increased by negative bi
asing. Above this T(s), SiC growth increases rapidly and the film beco
mes textured near 800-degrees-C, as the growth of beta-SiC(001) aligne
d with Si(001) can be observed. The SiC topmost-layer structure is cri
tically dependent on the plasma conditions with respect to the thermal
processing at the film growth interruption. When the plasma is switch
ed off before heating, the surface is essentially Si rich and oxidizab
le. In the opposite case, the H-2 plasma etches the Si-terminated over
layer and passivates the surface.