Raman scattering spectra of 3C-SiC films, grown heteroepitaxially on S
i(111) substrates by chemical vapor deposition (CVD), were measured to
obtain information on the relaxation mechanism of the internal stress
of the 3C-SiC films. The internal stress is found to be relaxed by th
e formation of the voids at the interface between 3C-SiC film and Si s
ubstrate during the CVD process.