We have demonstrated a selective etch process of removing a GaAs subst
rate for the fabrication of ZnSe-based surface emitting lasers using t
he PA etchant (NH3OH:H2O2:H2O=x:33:10) and employing a spray method. T
he etch rate of a GaAs substrate was 3.7 mum/min with a preferential e
tch rate ratio of over 20 against ZnSe layers. The surface of the ZnSS
e layer after removal of a substrate was smooth enough to fabricate Zn
Se-based surface emitting lasers.