THERMAL-STABILITY OF W2N FILM AS A DIFFUSION BARRIER BETWEEN AL AND SI

Authors
NOYA A TAKEYAMA M SASAKI K AOYAGI E HIRAGA K
Citation
A. Noya et al., THERMAL-STABILITY OF W2N FILM AS A DIFFUSION BARRIER BETWEEN AL AND SI, JPN J A P 1, 33(3A), 1994, pp. 1528-1529
Citations number
5
Categorie Soggetti
Physics, Applied
Journal title
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS → ACNP
Volume
33
Issue
3A
Year of publication
1994
Pages
1528 - 1529
Database
ISI
SICI code
Abstract
Thermal stability of the contact system of Al/W2N/Si is studied by cha racterization techniques of cross-sectional transmission electron micr oscopy, X-ray diffraction and Auger electron spectroscopy. It is revea led that the effective suppression of grain growth Of W2N barrier is i mportant to the total stability of this system.