Multichip modules are important to the advancement of modem high-perfo
rmance radar, communication, and navigation systems. Besides improved
electrical performance, these modules offer reductions in weight, enha
nced thermal and mechanical characteristics, and improved reliability.
With the growing need for smaller, lighter electronics for spaceborne
and defense applications, the Applied Physics Laboratory is using sta
te-of-the-art design software, materials, and microelectronics fabrica
tion techniques to build multichip modules for advanced microwave appl
ications. This article describes two of these applications: a 14-GHz t
ransmit and receive module and a 32-GHz active antenna array. These ad
vanced design and packaging initiatives have demonstrated the dramatic
reductions in size and weight that their application to modem electro
nics systems can achieve.