Qz. Liu et al., EPITAXY OF AL FILMS ON GAN STUDIED BY REFLECTION HIGH-ENERGY ELECTRON-DIFFRACTION AND ATOMIC-FORCE MICROSCOPY, Applied physics letters, 70(8), 1997, pp. 990-992
Epitaxy of Al films deposited on GaN has been studied using reflection
high-energy electron diffraction (RHEED), atomic force microscopy (AF
M), x-ray diffraction, and ion channeling techniques. Al (111) films h
ave been found to grow epitaxially on GaN (0001) surfaces with Al <[2(
11)over bar]>parallel to GaN<[2(11)over bar 0]>. For growth at 15 and
150 degrees C with a deposition rate of 0.26 Angstrom/s, the epitaxial
quality of the film was poor initially, as evidenced by the observati
on of diffuse RHEED patterns. After a few monolayers, a sharp and stre
aky RHEED pattern develops and is maintained during subsequent deposit
ion, indicating an improvement in epitaxial quality with a two-dimensi
onal growth mode. AFM studies indicate that the initial GaN surface qu
ality is a significant factor in achieving epitaxial growth, and that
the size of Al epitaxial islands increases substantially for higher gr
owth temperatures. X-ray diffraction and ion channeling results confir
m the epitaxial nature of the Al films in spite of a significant latti
ce mismatch of 10.2%. (C) 1997 American Institute of Physics.