THERMAL CHARACTERIZATION OF MICROSYSTEMS BY MEANS OF HIGH-RESOLUTION THERMOGRAPHY

Citation
M. Ashauer et al., THERMAL CHARACTERIZATION OF MICROSYSTEMS BY MEANS OF HIGH-RESOLUTION THERMOGRAPHY, Microelectronics, 28(3), 1997, pp. 327-335
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
ISSN journal
00262692
Volume
28
Issue
3
Year of publication
1997
Pages
327 - 335
Database
ISI
SICI code
0026-2692(1997)28:3<327:TCOMBM>2.0.ZU;2-E
Abstract
Thermal measurements on microsystems prove difficult due to small ther mal masses and high thermal gradients, namely on thermally powered act uators. Compared with contacting thermometry or integration of thermal ly sensitive structures, thermography as a two-dimensional method may be a very powerful and exact method of measuring device temperatures a nd heat fields. The load capacity of interconnection lines, a bimetal micro actuator, and the development of a thermopneumatical actuator, a re reported as examples for successful employment of infrared thermogr aphy in microtechnology. (C) 1997 Elsevier Science Ltd.