Kovar pins were attached to tungsten-metallized, alumina ceramic packa
ges with Ag-Cu alloys using a wide range of brazing process parameters
that were systematically varied in a designed experiment. The impact
of the brazing thermal process, furnace atmosphere, brazing filler met
al composition, and brazing filler metal quantity on the performance o
f ceramic pin-grid arrays was assessed through mechanical and environm
ental tests. Metallographic analyses revealed that a wide range of bra
zement microstructure, macrostructure, and base metal interaction were
produced. Nevertheless it was found that these divergent conditions h
ad no detrimental effect on the cofired ceramic performance as judged
by the results of pin-pull tests after exposure to vibrational fatigue
, thermal shock, salt-spray corrosion, and temperature-humidity cyclin
g. The lack of ceramic degradation, despite exposure to more severe br
azing conditions than previously reported in the literature, is attrib
uted to the combined quality of the package design, the materials set,
and the fabrication processes.