Highly metastable pseudomorphic Ge0.3Si0.7 layers 570 nm thick were gr
own on Si(100) at approximately 300-degrees-C by molecular-beam epitax
y. The relief of strain in such metastable layers upon ex situ thermal
annealing in vacuum is investigated by double-crystal x-ray diffracto
metry and MeV He-4 channeling spectrometry. Upon isochronal annealing
of 30 min, the strain relieves sharply at (375 +/- 25)degrees-C, and r
eaches the thermal equilibrium value above 400-degrees-C. Under isothe
rmal annealing between 300 and 400-degrees-C, the time evolution of th
e strain relief has the characteristics of a nucleation and growth tra
nsformation. The strain relief is very slow initially, increases appro
ximately linearly as the strain is partially relieved, and saturates u
pon approaching equilibrium strain state. Two important results are dr
awn from the experimental data. First, a deformation-mechanism map is
constructed from which the strain relief rate of a metastable GeSi/Si
can be extrapolated for given stress state and temperature. Second, th
e rate of the strain relief when the strain is partially relieved incr
eases with rising temperature, and follows an Arrhenius behavior as a
function of the inverse temperature with a slope of 2.1 +/- 0.2 eV Thi
s value coincides with the activation energy for dislocation glide in
Ge0.3Si0.7. Furthermore, the strain-relief equation of a plastic flow
model is solved and fits well the experimental strain-time dependence.
One of the two fitting parameters, the time constant, has an Arrheniu
s temperature dependence. The slope, 1.9 +/- 0.2 eV, is assumed to be
the activation energy for dislocation motion, and agrees with the prev
ious value extracted from the simple rate-temperature dependence. In a
ddition, as the strain is relieved, the x-ray-diffraction peak from th
e layer broadens and the channeling yield increases, confirming that t
he generation of misfit dislocations associated with the strain relief
is accompanied by the generation of threading dislocations in the lay
er.