Shallow arsenic junctions were formed in short processing times using
gas-phase rapid thermal diffusion with arsine or tertiarybutylarsine (
TBA). A 60 s gas-phase diffusion at 1100-degrees-C using 3.6% arsine i
n helium at 760 Torr formed 150 nm junctions with a measured sheet res
istance of 100 OMEGA/square. Shallow junctions were also formed with a
12 min diffusion at 900-degrees-C using 10% TBA in argon at 10 Torr.
These TBA-formed junctions have arsenic concentration at the silicon s
urface greater than 1 x 10(20) atm/cm3 and a sheet resistance of 244 O
MEGA/square. In addition, TEM cross sections show no process-induced d
amage at the junction for gas-phase doping.