MBE growth and infrared device fabrication with epitaxial IV-VI layers
on Si substrates are reviewed. Epitaxy on Si substrates is achieved u
sing a stacked BaF2/CaF2 or CaF2 buffer layer. With buffers containing
no BaF2, standard photolithographic delineation with wet-etching tech
niques can be used. Photovoltaic IV-VI sensors with cutoff wavelengths
ranging from 3 to 14 mum are fabricated in PbS, PbSe1-xSx, PbEu1-xSex
, PbTe, or Pb1-xSnSe layers on Si (111) substrates. They offer the pos
sibility for low-cost infrared focal plane arrays with sensitivities s
imilar to Hg1-xCdxTe, but with much less demanding material processing
steps. A 13-mm-long linear array with 10.5-mum cutoff wavelength has
inhomogeneities in cutoff below 0.1 mum. Some arrays were grown on pre
fabricated active Si substrates containing the whole readout circuits.
First thermal images using these chips are demonstrated. The induced
mechanical strain resulting from the different thermal expansion of IV
-VIs and Si relaxes down to cryogenic temperatures even after many tem
perature cycles because of dislocation glide in the main {100} glide p
lanes.