ALIGNMENT ISSUES IN PACKAGING FOR FREE-SPACE OPTICAL INTERCONNECTS

The addition of optics to electronics in optoelectronic packaging for free-space optical interconnects alters the nature of electrical packa ging design methodologies as well as the complexity of implementation. One such complexity arises from the stringent alignment requirement a mong the microlaser, computer-generated holographic element, and detec tor. The alignment achieved in the system is a function of assembly to lerance and working environment conditions such as operating temperatu re. The impact of these constraints on the alignability of the assembl y of free-space optical interconnects is quantitatively analyzed.