Humidity-dependent swelling of polyimide layers on silicon membranes i
s described. A simulation strategy using the finite element method (FE
M) to predict the resultant deformation of the double-layer system is
obtained. A humidity extension coefficient alpha(phi) is introduced an
d determined by means of X-ray bending measurement and backward simula
tion. The FEM is used to investigate the influence of possible technol
ogical tolerances of layer thickness, coefficient alpha(phi) and chip-
clamping on the behaviour of the system. For convenience an analytical
equation for temperature- or humidity-induced deformation of bimorphs
is presented, using the concentrated-element theory. Finally, a compa
rison of the results simulated by FEM shows a satisfactory agreement w
ith experimental investigations.