D. Girata et al., PLASMA CHARACTERIZATION OF A HIGH-PRESSURE D-SPUTTERING SYSTEM USED FOR THE IN-SITU PREPARATION OF HIGH-TC SUPERCONDUCTING THIN-FILMS, Solid state communications, 90(9), 1994, pp. 539-542
A characterization of the high-pressure dc-Sputtering system, used for
the ''in situ'' preparation of high-quality high-T(C) superconducting
thin films, was performed by plasma electrical measurements using a s
ingle Langmuir probe. A correlation between plasma characteristics and
thin film properties (transition temperature, T(C), transition width,
DELTAT(C) and residual resistivity ratio RRR) is presented. The param
eters of the plasma were obtained from measurements at pressures rangi
ng from 2.0 to 4.0 mbar with unheated and heated substrates (around 75
0-degrees-C) during the ''in situ'' preparation of YBa2Cu3O7-x thin fi
lms. We found that anode heating contributes to the formation of posit
ive ions and reduces the formation of negative ions, which minimizes t
he re-sputtering effects during film growth. Optimal superconducting p
roperties of the films were obtained at an oxygen pressure of 3.25 mba
r; at this pressure the plasma has the largest density of positive ion
s and the lowest density of both electron and negative ions.