MICROSTRUCTURES AND CRITICAL THICKNESSES OF INXGA1-XAS GAAS STRAINED-LAYER STRUCTURES

Citation
Jy. Yao et al., MICROSTRUCTURES AND CRITICAL THICKNESSES OF INXGA1-XAS GAAS STRAINED-LAYER STRUCTURES, Semiconductor science and technology, 9(5), 1994, pp. 1086-1095
Citations number
61
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Condensed Matter","Material Science
ISSN journal
02681242
Volume
9
Issue
5
Year of publication
1994
Pages
1086 - 1095
Database
ISI
SICI code
0268-1242(1994)9:5<1086:MACTOI>2.0.ZU;2-N
Abstract
The development of structural defects in InxGa1-xAs/GaAs strained-laye r structures, grown by molecular beam epitaxy, was investigated by tra nsmission electron microscopy. Three different critical layer thicknes ses, corresponding to the formation of three different types of defect s, were observed with increasing thicknesses of the strained layers. T hese defects were: rough interfacial topographies resulting from an on set of three-dimensional growth for the InxGa1-x layers; misfit disloc ations of the 60-degrees mixed type; and dislocation complexes consist ing of planar defects on {111} planes.