Jy. Yao et al., MICROSTRUCTURES AND CRITICAL THICKNESSES OF INXGA1-XAS GAAS STRAINED-LAYER STRUCTURES, Semiconductor science and technology, 9(5), 1994, pp. 1086-1095
The development of structural defects in InxGa1-xAs/GaAs strained-laye
r structures, grown by molecular beam epitaxy, was investigated by tra
nsmission electron microscopy. Three different critical layer thicknes
ses, corresponding to the formation of three different types of defect
s, were observed with increasing thicknesses of the strained layers. T
hese defects were: rough interfacial topographies resulting from an on
set of three-dimensional growth for the InxGa1-x layers; misfit disloc
ations of the 60-degrees mixed type; and dislocation complexes consist
ing of planar defects on {111} planes.