PACKAGING FOR OPTOELECTRONIC INTERCONNECTIONS

If optoelectronics are to be widely applied in consumer products as we ll as specialized technologies, the cost of packaging the components m ust be kept down. Until recently, the specialized nature of optoelectr onics applications meant that packaging was mainly an afterthought. To day, it is becoming a vital part of the overall device planning and ma nufacturing process. This article describes some of the technologies a nd costs associated with optoelectronic device packaging.