INTERFACIAL REACTIONS BETWEEN SAPPHIRE AND SILVER-COPPER-TITANIUM THIN-FILM FILLER METAL

Wetting and brazing studies of sputtering-deposited, submicrometer thi n film filler metal in an Ag-Cu-Ti/Al2O3 system mere performed. The in terfacial reaction layer between the filler metal and Al2O3 was invest igated. It is possible to make a brazing joint even with a reaction la yer of less than 100 nm thickness, Different types of interfacial reac tion layers were observed when the Ti content in the filler metal was varied. The Cu-Ti-O system compounds were observed in the samples with high wetting capabilities, but not in the sample with low wetting cha racteristics. It was found that these compounds are substances that pr omote effective brazing.