CHEMOMECHANICAL POLISHING OF SILICON - SURFACE TERMINATION AND MECHANISM OF REMOVAL

Citation
Gj. Pietsch et al., CHEMOMECHANICAL POLISHING OF SILICON - SURFACE TERMINATION AND MECHANISM OF REMOVAL, Applied physics letters, 64(23), 1994, pp. 3115-3117
Citations number
22
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
64
Issue
23
Year of publication
1994
Pages
3115 - 3117
Database
ISI
SICI code
0003-6951(1994)64:23<3115:CPOS-S>2.0.ZU;2-3
Abstract
Infrared spectroscopy of Si(111) samples immediately after chemomechan ical planarization with silica slurry (''siton polishing'') shows that the surfaces are predominantly terminated by hydrogen. This hydrogen termination is responsible for the observed strong hydrophobicity peak at a slurry pH of 11, at which point a monohydride termination prevai ls. At higher or lower pH, silanol groups replace some of the hydrogen species causing an increase in surface hydrophilicity. A removal mech anism is proposed which involves the interplay of oxidation by OH- and subsequent termination by H.