Gj. Pietsch et al., CHEMOMECHANICAL POLISHING OF SILICON - SURFACE TERMINATION AND MECHANISM OF REMOVAL, Applied physics letters, 64(23), 1994, pp. 3115-3117
Infrared spectroscopy of Si(111) samples immediately after chemomechan
ical planarization with silica slurry (''siton polishing'') shows that
the surfaces are predominantly terminated by hydrogen. This hydrogen
termination is responsible for the observed strong hydrophobicity peak
at a slurry pH of 11, at which point a monohydride termination prevai
ls. At higher or lower pH, silanol groups replace some of the hydrogen
species causing an increase in surface hydrophilicity. A removal mech
anism is proposed which involves the interplay of oxidation by OH- and
subsequent termination by H.