NON-MASS-SEPARATED ION SHOWER DOPING OF POLYCRYSTALLINE SILICON

Authors
Citation
Y. Mishima et M. Takei, NON-MASS-SEPARATED ION SHOWER DOPING OF POLYCRYSTALLINE SILICON, Journal of applied physics, 75(10), 1994, pp. 4933-4938
Citations number
11
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00218979
Volume
75
Issue
10
Year of publication
1994
Part
1
Pages
4933 - 4938
Database
ISI
SICI code
0021-8979(1994)75:10<4933:NISDOP>2.0.ZU;2-D
Abstract
Practical polycrystalline silicon thin-film transistors need a low-tem perature doping technique. Ion shower doping with a main ion source of P2Hx (x = 1, 2,...) was studied. This technique implants a molecule i n the polycrystalline silicon surface with a low acceleration voltage. A critical impurity density from polycrystalline phase to amorphous p hase for phosphorus in polycrystalline silicon of 2.0 x 10(20) ions/cm 3 was found. Sheet resistance with ion shower doping was lower than wi th conventional ion implantation at low temperature. This is a result of an increase in sheet carriers, because the low-temperature recoveri ng of defects is done by molecular implantation and hydrogen atoms com pensate defects. Implanted polycrystalline Si with a Hall mobility of 5 cm2/V s was obtained.