Short-channel effects in deep-submicrometer SOI MOSFET's are explored
over a wide range of device parameters using two-dimensional numerical
simulations. To obtain reduced short-channel effects in SOI over bulk
technologies, the silicon film thickness must be considerably smaller
than the bulk junction depth because of an additional charge-sharing
phenomenon through the SOI buried oxide. The optimal design space, con
sidering nominal and short-channel threshold voltage, shows ample desi
gn options for both fully and partially depleted devices, however, man
ufacturing considerations in the 0.1 mum regime may favor partially de
pleted devices.