The influence of chemically active metal Al deposition on Ti - oxidize
d silicon interface at 300-430 C has been studied. The results of Ti-S
i interface investigation after Al deposition on Ti layer and followin
g annealing are compared with the conclusions of thermodynamical estim
ates of reaction probabilities in Ti-Si, Ti-SiO2, Al-SiO2, Al-TiO2 sys
tems.