M. Lorenz et al., REACTIVE DIFFUSION IN PD NI/CUSN6 LAYER SYSTEMS AT 500-DEGREES-C/, Fresenius' journal of analytical chemistry, 349(1-3), 1994, pp. 253-254
The interdiffusion in Pd/Ni/CuSn6 layer systems has been investigated.
Intermetallic phase formation (Ni-Sn or Ni-Pd-Sn phases) occurs along
grain boundaries and within the grains of the substrate material as a
result of reactive diffusion. Phase growth kinetics follow a paraboli
c time law.