AIR COOLING OF FRONT-END ELECTRONICS FOR SILICON DETECTORS IN A COLLIDER EXPERIMENT

Authors
LOCK JS BERTSON E BOISSEVAIN J CLARK DJ COLLIER W HAMMOCK R JACAK BV MORGAN A ROYBAL P SHAHEEN S SIMONGILLO J SULLIVAN JP
Citation
Js. Lock et al., AIR COOLING OF FRONT-END ELECTRONICS FOR SILICON DETECTORS IN A COLLIDER EXPERIMENT, Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 345(2), 1994, pp. 284-288
Citations number
4
Categorie Soggetti
Nuclear Sciences & Tecnology","Physics, Particles & Fields","Instument & Instrumentation",Spectroscopy
Journal title
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment → ACNP
ISSN journal
01689002
Volume
345
Issue
2
Year of publication
1994
Pages
284 - 288
Database
ISI
SICI code
0168-9002(1994)345:2<284:ACOFEF>2.0.ZU;2-F
Abstract
We have investigated the feasibility of using room temperature air to cool front-end electronics for silicon microstrip and pad detectors in a collider experiment. Advantages of air cooling include minimal mate rial in the path of the particles and no potential of coolant spills i n the silicon region. A prototype cooling system was tested with heat provided by flat resistive heaters. Heat loads from 1 to 27 mW/channel were studied, making the results applicable to various silicon detect or systems. The measurements are compared to cooling system performanc e predictions. A set of simple equations has been identified and teste d which reliably describe the lab setup.