EFFECT OF INTERFACE ON THE PROPERTIES OF TI NIFE THIN-FILMS/

The microstructure, anisotropic magnetoresistance, and magnetic proper ties of Ti/Ni81Fe19 thin films have been investigated with respect to annealing temperatures (T(A)) up to 450-degrees-C as well as to anneal times (t(A)). It has been shown that 120-degrees-C is the optimum ann ealing temperature and that t(A) has no significant influence on the p roperties with annealing at 270-degrees-C. Auger depth profiling was u sed to study interdiffusion kinetics. The diffusivity D and activation energy epsilon have been estimated at about 2.0 X 10(-17) cm2/s and 1 .69 eV, respectively.