Arsenic (As) and boron (B) ions were implanted into silicon (Si) at en
ergies such that their projected ranges coincided. The implanted Si wa
s annealed in argon gas at a temperature of 950-degrees-C for 30 or 30
0 min. The activation efficiency of the implanted As atoms decreased w
ith an increase in the implant dose of the B ions, and the diffusivity
of the As atoms decreased. On the other hand, the diffusivity of the
B atoms decreased with an increase in annealing time.