To study compositional variations in Ti-W films sputtered from Ti-W al
loy targets and deposited over topographical features, the sticking co
efficients and angular distributions of sputtered flux arriving at the
substrate for titanium (Ti) and tungsten (W) atoms have been investig
ated by an overhang structure, pinhole experiment, and simulation pack
age. The simulation involves the combination of a vapor transport mode
l which is able to model the angular distributions for the respective
materials, and a film growth model which is able to predict the compos
itional variation of the deposited Ti-W films over topographical featu
res. Experimentally, it was found that the sticking coefficients of Ti
and W are both very close to unity for the conditions considered. How
ever, the angular distributions of these two materials are quite diffe
rent due to their different transport properties through the sputter g
as. For the Ti-W films, the compositional variations calculated using
the simulated angular distributions agreed well with the ones measured
experimentally. This result clearly demonstrates that the differences
between the angular distributions of Ti and W atoms cause the composi
tional variations in the films. In the case of Ti-W films deposited ov
er vias or trenches, the films on the sidewalls are Ti enriched, but o
n the bottom are Ti deficient. The good agreement between the simulati
on and experimental results indicates that the model will be very usef
ul for predicting and optimizing the properties of films deposited by
alloy targets.