VACUUM-ARC DEPOSITION AS A COMPLEMENTARY TECHNOLOGY TO LASER PROCESSING

Vacuum are deposition unifies the advantages of laser ablation and mag netron sputtering. The evaporation of the target in the are discharge permits to deposit the refractory materials with a high rate. The evap oration products are highly ionized and the possibility exists to cont rol the discharge with a magnetic field. The deposition rate, R(d), Of MO films produced by vacuum are deposition on Cu and silica glass sub strates has been studied. The target of purified Mo has been made by h igh-vacuum electron beam melting. R(d) depends critically on the angle between the substrate and the cathode surfaces being maximal when the y are parallel. The adhesion of the Mo coating to Cu is much higher th an to silica glass substrate. R(d) as high as 15 nm/s has been reached . R(d) increases with increasing deposition power, It decreases with i ncreasing distance from the cathode slower than in the case of magnetr on sputtering, The microparticles forming by the vacuum are evaporatio n incorporate in the layer during the deposition procedure increasing the deposition rate.