Previous conflicting reports concerning fully depleted SOI device hot
electron reliability may result from overestimation of channel electri
c field (E(m)). Experimental results using SOI MOSFET's with body cont
acts indicate that E(m) is just a weak function of thin-film SOT thick
ness (T(si)) and that E(m) can be significantly lower than in a bulk d
evice with drain junction depth (X(j)) comparable to SOI's T(si). The
theoretical correlation between SOI MOSFET's gate current and substrat
e current are experimentally confirmed. This provides a means (I(G)) o
f studying E(m) in SOI device without body contacts. Thin-film SOI MOS
FET's have better prospects for meeting breakdown voltage and hot-elec
tron reliability requirements than previously thought.