The morphology of the gas-solid interface during typical chemical vapo
r deposition (CVD) processes is investigated. The dynamic behavior of
the interface depends on many factors, including local curvature of th
e film, reactant diffusion, adsorption equilibrium, surface kinetics,
and mobility of adatoms. These factors depend on material properties o
f the system and reactor conditions, such as the deposition temperatur
e and pressure. A 2-D model proposed describes the evolution of the in
terface in Cartesian coordinates under the influence of stabilizing an
d destabilizing effects. A linear stability analysis is used to predic
t under which conditions a planar interface becomes unstable. Stabilit
y criteria of a simplified 1-D analysis is not necessarily valid if th
e real system has more than one dimension. The substrate temperature a
nd reactor pressure are important factors affecting the stability of f
ilm growth and thus the morphology of CVD films. An increase in temper
ature stabilizes planar film growth if the deposition is diffusion-lim
ited, but destabilizes it if the process is reaction-controlled. The r
eactor pressure has a destabilizing effect on planar film growth durin
g a typical CVD process.