J. Piprek et Sjb. Yoo, THERMAL COMPARISON OF LONG-WAVELENGTH VERTICAL-CAVITY SURFACE-EMITTING LASER-DIODES, Electronics Letters, 30(11), 1994, pp. 866-868
Heat flow finite element analysis is applied to basic device concepts,
including planar structures with InGaAsP/InP or AlAs/GaAs substrate s
ide mirrors (mounted top-up or top-down) and etched-well lasers with S
i/SiO2 dielectric mirrors. In several cases, the calculated thermal re
sistance values are higher than with short-wavelength devices, but waf
er-fused structures on GaAs substrate show clear thermal advantages.