INFLUENCE OF PHASE LAYERS ON COPPER ELECTRODEPOSITION KINETICS IN CU(II) SOLUTIONS CONTAINING GLYCINE, ALPHA-ALANINE, OR BETA-ALANINE

The kinetics of copper electrodeposition from Cu(II) solutions contain ing glycine or alpha-alanine was discussed under the assumption that t he rate-determining step in the consecutive transfer of electrons chan ges on account of destruction of a Cu2O phase layer. Current-voltage c urves calculated theoretically with the surface concentrations and est ablished values of the kinetic parameters are in satisfactory agreemen t with the experimental data. The method of analysis employed does not yield satisfactory results in the Cu/Cu(II), beta-alanine system, whe re much thicker phase films are formed at the interface.