Cs. Li et al., ON CRYSTALLOGRAPHIC CRACK TRANSFER ACROSS INTERFACES IN 4 TYPES OF ALUMINUM BICRYSTAL, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 183(1-2), 1994, pp. 23-30
Crack growth behavior across grain boundaries (GBS) in four types of a
luminum bicrystal, including [121BAR] tilt symmetric, [121BAR] tilt ps
eudosymmetric, [012]-[111], and [121BAR] 180-degrees tilt bicrystals,
was studied. Cracks generally decelerate at GBs in these bicrystals un
der a constant cyclic load. It was also found that the variation in gr
owth rate at a GB depends on the relative orientation of the two grain
s on opposite sides of the GB, the GB microstructure, and the applied
stress. Two modes of crack transfer across GBs were identified: at a G
B with a pair of nearly parallel slip systems, located respectively, o
n its two sides, the crack transfers smoothly by following the pair of
slip bands; at other GBs the crack splits, branches into up to three
secondary slip bands, and decelerates dramatically at a constant cycli
c stress. Interface-resistance to fatigue crack transfer across a GB w
as rationalized according to dislocation movement across it.