Selective growth of Ge in GeF4-Si2H6 system was investigated on SiO2 p
atterned Si substrates and its characteristics were discussed in compa
rison with those of W chemical vapor deposition in WF6-SiH4 system whi
ch is similar in terms of a combination of redox materials including a
fluorinated substance. The selectivity was governed primarily by the
growth temperature. The selective growth on a SiO2 patterned Si substr
ate was achieved at a wide range of the gas flow ratios (Si2H6/GeF4) a
t 375-degrees-C, where the characteristics of film growth were disting
uished clearly from those at the temperatures over-400-degrees-C large
r quality degraded. The experimental results indicated that the select
ivity was deeply rooted in the growth mechanisms of the film themselve
s which were separated around 400-degrees-C.