This paper deals with a new type of humidity sensor. Whereas conventio
nal humidity sensors utilize the change of the specific resistivity or
the dielectric properties here the humidity induced volume change of
a polyimide layer leads to a deformation of a silicon membrane. The be
nding stresses will be transformed into an output voltage by a piezore
sistive Wheatstone bridge. This principle offers many advantages: (i)
a separation of electrical transducing elements (piezoresistors) from
measured humidity value, (ii) an advanced electrical long-term stabili
ty owing to qualified passivation concepts for the piezoresistors, (ii
i) the well-known opportunities to miniaturize humidity sensors using
semiconductor technologies and micromechanics, (iv) use of only conven
tional IC processes. The fabrication process of the developed humidity
sensor is nearly like that of a common pressure sensor. The first fab
ricated and tested piezoresistive humidity sensors showed a comparable
behaviour to capacitive thin-film humidity sensors, that means fast t
ransient response (T90 almost-equal-to 20-25 s) and high accuracy (dow
n to 1% r.h.).