In the near future the laser source will be used to full effect in mic
rofabrication. The spectral brightness of the excimer laser will proba
bly propel it to a position as the dominant source for lithography. Th
is will be implemented at the ArF 193 nm wavelength, perhaps to dimens
ions as small as 0.15 mum in a production environment. In addition, a
second technology, laser direct writing, will take on important strate
gic applications for circuit prototyping and postfabrication (final st
ep) processing. The former technology is posed as a simpler, faster, a
nd less expensive alternative to X-ray, electron-beam, or ion-beam lit
hography for fabricating next generation VLSI. The latter would make m
ethods available for real-time interactive circuit design and will bec
ome an enabling technology for multichip modules and three-dimensional
micromechanics.