ADVANCES IN MATERIALS AND PROCESSES FOR HIGH-PERFORMANCE ELECTRONICS FABRICATION AND ASSEMBLY .2.

Authors
SEIBOLD RW LICARI JJ BROWN RL HARPER CA TRASK PA
Citation
Rw. Seibold et al., ADVANCES IN MATERIALS AND PROCESSES FOR HIGH-PERFORMANCE ELECTRONICS FABRICATION AND ASSEMBLY .2., S.A.M.P.E. journal, 33(2), 1997, pp. 9-16
Citations number
9
Categorie Soggetti
Material Science",Engineering
Journal title
S.A.M.P.E. journal → ACNP
ISSN journal
00911062
Volume
33
Issue
2
Year of publication
1997
Pages
9 - 16
Database
ISI
SICI code
0091-1062(1997)33:2<9:AIMAPF>2.0.ZU;2-M
Abstract
Five key advances in materials and processes for high-performance elec tronics fabrication and assembly are addressed. These are: 1) material s for thermal management; 2) low-temperature co-fired ceramics (LTCCs) ; 3) advanced organic printed circuit board (PCB) materials; 4) direct patterning of dielectric materials; and 5) environmentally friendly e lectronic materials and processes.