ADVANCED QUALIFICATION TECHNIQUES

This paper demonstrates use of the Qualified Manufacturers List (QML) methodology to qualify commercial and military microelectronics for us e in space applications. QML ''builds in'' the hardness of product thr ough statistical process control (SPC) of technology parameters releva nt to the radiation response, test structure to integrated circuit (IC ) correlations, and techniques for extrapolating laboratory test resul ts to low-dose-rate space scenarios. Each of these elements is demonst rated and shown to be a cost-effective alternative to expensive end-of -line IC testing. Several examples of test structure-to-IC correlation s are provided and recent work on complications arising from transisto r scaling and geometry is discussed. The use of a 10-keV x-ray wafer-l evel test system to support SPC and establish ''process capability'' i s illustrated and a comparison of 10-keV x-ray and Co-60 gamma irradia tions is provided for a wide range of CMOS technologies. The x-ray tes ter is shown to be cost-effective and its use in lot acceptance/qualif ication is recommended. Finally, a comparison is provided between MIL- STD-883, Test Method 1019.4, which governs the testing of packaged sem iconductor microcircuits in the DoD, and ESA/SCC Basic Specification N o. 22900, Europe's Total Dose Steady-State Irradiation Test Method. Te st Method 1019.4 focuses on conservative estimates of MOS hardness for space and tactical applications, while Basic Specification 22900 focu ses on improved simulation of low-dose-rate space environments.