Nv. Sotskaya et al., STABILIZING EFFECT OF SOME MICROADDITIVES ON ELECTROLESS NICKEL-PLATING, Russian journal of applied chemistry, 66(7), 1993, pp. 1293-1294
The stabilizing effect of some sulfur- and nitrogen-containing compoun
ds and surfactants on the process of electroless nickel plating has be
en studied. Disodium salt of 4,4'-dithiodibenzenedisulfonic acid and i
ts blends with lead sulfide and polyethylene glycol have been shown to
have the greatest effect.