P-channel Si1-xGex MOSFETs with peak Ge content x = 0.3, 0.4, and 0.5
have been fabricated via MBE and experimentally characterized from roo
m temperature down to 5K. Mobility enhancements relative to identicall
y processed Si controls were largest at the lowest temperatures. The h
ighest mobility measured, mu(FE) = 1622 cm2/V.sec for the x = 0.3 SiGe
device, was approximately a factor of four higher than the mobility o
f the Si control devices. Peak mobility decreased as the fraction of G
e in the SiGe channel layer increased for the range of concentrations
studied here.