ALLOY ELECTRODEPOSITION FOR ELECTRONIC APPLICATIONS

Citation
Pl. Cavallotti et al., ALLOY ELECTRODEPOSITION FOR ELECTRONIC APPLICATIONS, Electrochimica acta, 39(8-9), 1994, pp. 1123-1131
Citations number
26
Categorie Soggetti
Electrochemistry
Journal title
ISSN journal
00134686
Volume
39
Issue
8-9
Year of publication
1994
Pages
1123 - 1131
Database
ISI
SICI code
0013-4686(1994)39:8-9<1123:AEFEA>2.0.ZU;2-Z
Abstract
Alloy thin films of interest for possible electronic applications were obtained by electrodeposition: Ni-Fe for magnetic heads, Co alloys fo r magnetic recording and Cu-Sb as a possible underlayer for electric c ontacts. Permalloy ECD Ni-Fe films were deposited from acid baths on S i wafers, patterned by photolithography; Co-Pt and Co-Pd films from ba ths of similar composition, obtaining hard Co-Pt and soft Co-Pd layers ; Cu-Sb as oversaturated solid solutions or as multilayers depending o n the deposition conditions. Electrokinetic behaviour and related stru ctures are interpreted by means of the normality-inertia parameter P(n i).