VOLTAMMETRIC BEHAVIOR OF THE COPPER(II) THIOUREA SYSTEM IN SULFURIC-ACID MEDIUM AT PLATINUM AND GLASSY-CARBON ELECTRODES

Authors
COFRE P BUSTOS A
Citation
P. Cofre et A. Bustos, VOLTAMMETRIC BEHAVIOR OF THE COPPER(II) THIOUREA SYSTEM IN SULFURIC-ACID MEDIUM AT PLATINUM AND GLASSY-CARBON ELECTRODES, Journal of Applied Electrochemistry, 24(6), 1994, pp. 564-568
Citations number
12
Categorie Soggetti
Electrochemistry
Journal title
Journal of Applied Electrochemistry → ACNP
ISSN journal
0021891X
Volume
24
Issue
6
Year of publication
1994
Pages
564 - 568
Database
ISI
SICI code
0021-891X(1994)24:6<564:VBOTCT>2.0.ZU;2-W
Abstract
Thiourea, a levelling agent used in copper electrorefining baths, is t he focus of a cyclic and rotating disc or ring-disc electrode voltamme tric study. Thiourea adsorption, its interaction with Cu2+ and formati on of Cu(Tu)n+ complexes are part of the multistep electrode mechanism proposed. Results at platinum and glassy carbon electrodes are applic able to copper electrodes in electrorefining.