Citation
R. Jairath et al., CHEMICAL-MECHANICAL POLISHING - PROCESS MANUFACTURABILITY, Solid state technology, 37(7), 1994, pp. 71
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
0038111X
Volume
37
Issue
7
Year of publication
1994
Database
ISI
SICI code
0038-111X(1994)37:7<71:CP-PM>2.0.ZU;2-O
Abstract
Chemical-mechanical polishing (CMP) has become a widely accepted techn
ology for multlevel interconnects. This article focuses on the manufac
turability of the CMP process. Cost of ownership was a metric to highl
ight the strengths and weaknesses of this technology. Due to recent in
creases in the reliability of the polishing tools, the focus of the de
velopment activity has shifted to the role of consumables. Key technol
ogical challenges facing CMP consumables are discussed.