GROWTH, PHYSICAL-PROPERTIES, AND ADHESION OF COPPER-POLYPHENYLQUINOXALINE INTERFACES

Monochromatized x-ray photoelectron spectroscopy, contact angle measur ements, and peeling tests have been used to investigate the physicoche mical surface properties of polyphenylquinoxaline (PPQ) and of copper- PPQ interfaces. The surface composition and oxygen content of a polyme r that was deliberately oxidized by ultraviolet exposure in air were d etermined, and monitored during the anneal (up to 400-degrees-C) of th is thermostable polymer. Subsequent copper deposition in the monolayer range and film growth is characterized by small cluster formation, be fore percolation into a conducting metallic layer. Further anneal of t he Cu-PPQ interface is seen to promote diffusion of Cu into the polyme r, and to catalytically degrade the interface by oxidizing the polymer . These observations are correlated with peeling test measurements on the same Cu-PPQ interfaces: UV treatment combined with an anneal proce ss are shown to be deleterious to the mechanical properties of the int erface.